HVEMUL Contact

Power electronics hardware, engineered end to end.

Design, advisory and integration of power electronics hardware, from the electrical architecture to documentation ready for manufacture.

Discipline
Power electronics engineering
Based in
Valparaíso, Chile

Engineering services

Each engagement is scoped in writing and closed with documentation that stays with the client.

Design

Converters and power boards designed to the ratings of each client, delivered as a complete package ready for manufacture.

Advisory

Technical review of existing designs, topology and component selection, and support for teams building their own hardware.

Integration

Converters, control and instrumentation brought together into a working system, commissioned and measured on the bench.

Disciplines covered in house

The same team covers every stage, so electrical and mechanical decisions stay consistent from specification to release.

Multilayer power board layout on screen

Hardware design

Power stage, gate drive, sensing and protection on multilayer boards.

Exploded view of a mechanical assembly with bracket, housing and bearing

Mechanical design

Brackets, housings and mechanisms specified part by part for manufacture.

3D model of a vehicle platform

3D modelling

Complete assemblies modelled before fabrication, so fit and envelope are agreed on screen.

Four converter modules on heatsinks wired to an oscilloscope on the bench

Testing

Converters measured on the bench under real operating conditions.

Hand soldering a board under a stereo microscope

Assembly & soldering

Hand assembly and rework of fine pitch components under the microscope.

Converter modules plugged into a 19 inch rack above two programmable DC sources
Converter modules plugged into a 19 inch rack, above two programmable DC sources.

Converter design, delivered as a data package

Each design is handed over as a complete package, ready for manufacture. The result belongs to the client and can be quoted and fabricated anywhere, with no dependency on us.

Power conversion

Stages sized to the voltage, current and power of each application, with the topology chosen for the case rather than taken from a catalogue.

Mechanical format

Modules that plug into 19 inch 3U racks, benchtop enclosures or a mechanical envelope defined by the client.

Control interface

Gate signals over optical fibre and conditioned measurements, ready for C2000 boards and other control platforms.

Handover

Schematics, layout, fabrication files, 3D models and manual, in standard formats that any manufacturer can quote.

Request a quotation
Engineer recording converter measurements at a bench with programmable sources, a power analyser and oscilloscopes

From the schematic to the test bench.

Measurement campaign on a converter under test. AC3E, UTFSM.

Ghosted view of the platform interior assembly
C-Box platform module with BNC inputs, fault indicator and reset button
The C-Box platform module and a ghosted view of its interior assembly.

Control platform for the TI C2000 LaunchPad

A laboratory platform that removes the wiring, protection and signal conditioning work between a C2000 LaunchPad and a power stage. It works with the tools engineering teams already use.

ePWM outputs10 · over optical fibre
Fault indicator1 · over optical fibre
Analogue inputs10 × BNC, ±10 V, internally conditioned for the LaunchPad ADCs
Hardware protectionFault asserted and outputs disabled automatically above 3.3 V at any input
MechanicalEnclosure compatible with 3U racks
ToolchainMATLAB / Simulink · Code Composer Studio

How a project runs

Five phases, each closed by a review gate. Work does not advance until the preceding stage is signed off, so scope changes surface early rather than at release.

Requirements & specification freeze

Ratings, topology, interfaces and form factor are agreed and frozen as the design baseline.

Baseline review

Electrical architecture & simulation

Topology selection, component sizing, loss and thermal estimation, and SPICE verification of the critical stages.

Architecture review

Schematic & PCB layout

Schematic capture, multilayer layout, creepage and clearance, power and signal integrity.

Design review

Mechanical integration & 3D modelling

Enclosure, mounting and thermal path modelled in 3D and checked against the 3U rack envelope.

Integration review

Documentation & data release

The full deliverable package is compiled, reviewed and issued under a revision index.

Release review

Partners

Institutions and companies that support our research, development and implementation work.

HVEMUL
Universidad Técnica Federico Santa María
AC3E, Advanced Center for Electrical and Electronic Engineering
Solidcore Solutions
welabu

Have a project in mind?

Tell us about the hardware, the ratings and the timeline, and we will come back with a scoped proposal.

Request a quotation
Email
support@hvemul.cl
Response time
Within two working days
Registered office
Prat 856, Office 503 Valparaíso, Chile
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